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Jump to: 15 July 2006
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15 July 2006

Boon, Ooi Keng and Safa, Mohammad Samaun and Arumugam, Veeri (2006): TQM practices and affective commitment: a case of Malaysian semiconductor packaging organizations. Published in: International Journal of Management and Entrepreneurship , Vol. 1, No. 2 (15 July 2006): pp. 37-55.

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