TQM practices and affective commitment: a case of Malaysian semiconductor packaging organizations

Boon, Ooi Keng and Safa, Mohammad Samaun and Arumugam, Veeri (2006): TQM practices and affective commitment: a case of Malaysian semiconductor packaging organizations. Published in: International Journal of Management and Entrepreneurship , Vol. 1, No. 2 (15 July 2006): pp. 37-55.

Abstract

The purpose of the present study is to examine the effects of the five elements of TQM practices on employees’ affective commitment within six major Malaysian semiconductor contract manufacturing organizations. Despite extensive research on TQM practices, the issue of linking TQM practices with affective commitment has been found to be less focused. Sample size of the study was 377 resulting in a response rate of 75.4 percent. Regression analyses were employed to explore the relationship between TQM practices and affective commitment. Findings of the study reveal that teamwork, organizational communication, organizational trust and teamwork are positively associated with affective commitment. The study also shows that the organizational communication is perceived as a dominant TQM practice and is strongly associated with affective commitment.

• Item Type: MPRA Paper
• Language: English
• Keywords: Total quality management, affective commitment, Malaysia, semiconductor industry
• Subjects: D - Microeconomics > D2 - Production and Organizations

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